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Mandatory Greenhouse Gas Reporting

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CFR Correction

In Title 40 of the Code of Federal Regulations, Parts 96 to 99, revised as of July 1, 2014, on pages 696 through 698, in subpart I of part 98, tables I-5 through I-7 are corrected to read as follows:

Table I-5 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing

Process type factorsProcess gas i
CF4C2 F6CHF3CH2 F2C3 F8c− C4 F8NF3 RemoteNF3SF6C4 F6aC5 F8aC4 F8 Oa
Etch 1-Ui0.71 0.41 0.41 0.06NA1 0.2NA0.20.20.10.2NA
Etch BCF4NA1 0.41 0.071 0.08NA0.2NANANA1 0.30.2NA
Etch BC2 F6NANANANANA0.2NANANA1 0.20.2NA
CVD Chamber Cleaning 1-Ui0.90.6NANA0.40.10.020.2NANA0.10.1
CVD Chamber Cleaning BCF4NA0.1NANA0.10.12 0.022 0.1NANA0.10.1
CVD Chamber Cleaning BC3 F8NANANANANANANANANANANA0.4
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.
1 Estimate includes multi-gas etch processes.
2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.

Table I-6 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing

Process type factorsProcess gas i
CF4C2 F6CHF3CH2 F2C3 F8c− C4 F8NF3 RemoteNF3SF6
Etch 1-Ui0.6NA0.2NANA0.1NANA0.3
Etch BCF4NANA0.07NANA0.009NANANA
Etch BCHF3NANANANANA0.02NANANA
Etch BC2 F4NANA0.05NANANANANANA
CVD Chamber Cleaning 1-UiNANANANANANA0.030.30.9
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

Table I-7 To Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing

Process type factorsProcess gas i
CF4C2 F6CHF3CH2 F2C3 F8c− C4 F8NF3 RemoteNF3SF6
Etch 1-Ui0.70.40.4NANA0.2NANA0.4
Etch BCF4NA0.2NANANA0.1NANANA
Etch BC2 F6NANANANANA0.1NANANA
CVD Chamber Cleaning 1-UiNA0.6NANA0.10.1NA0.30.4
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CVD Chamber Cleaning BCF4NA0.2NANA0.20.1NANANA
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.
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[FR Doc. 2015-05549 Filed 3-11-15; 8:45 am]

BILLING CODE 1505-01-D