Bureau of Export Administration, Commerce.
The Bureau of Export Administration (BXA) maintains the Commerce Control List (CCL), which identifies those items subject to Department of Commerce export controls. The CCL also reflects multilateral national security controls established by the Wassenaar Arrangement on Export Controls for Conventional Arms and Dual-Use Goods (the Wassenaar Arrangement), of which the United States is a founding member. The Wassenaar Arrangement controls strategic items with the objective of improving regional and international security and stability.
In this regard, on December 1, 2000, the Wassenaar Arrangement agreed to implement several changes in its List of Dual-Use Goods and Technologies. This final rule revises the CCL to implement certain recently agreed changes in Category 3 (Electronics) and Category 4 (Computers) of the Wassenaar List of Dual-Use Goods and Technologies, specifically in the areas of microprocessors, graphic accelerators, and external interconnects. This change is being implemented to reflect rapid technological advances and controllability factors. Additional changes in the Wassenaar Dual-Use List Start Printed Page 18403will be implemented in the CCL in a supplemental regulation.
This rule is effective April 9, 2001.Start Further Info
FOR FURTHER INFORMATION CONTACT:
Tanya Hodge Mottley in the Office of Strategic Trade and Foreign Policy Controls, Bureau of Export Administration, U.S. Department of Commerce at (202) 482-1837.End Further Info End Preamble Start Supplemental Information
BXA will be publishing a separate regulation to implement other changes recently agreed to on the Wassenaar List of Dual-Use Goods and Technologies. These revisions will include changes to ECCNs in Categories 1 (Materials, Chemicals, “Microorganisms,” and Toxins), 2 (Materials Processing), 3 (Electronics), 4 (Computers), 5 part 1 (Telecommunications), 5 part 2 (Information Security), 6 (Lasers and Sensors), 7 (Navigation and Avionics), and 9 (Propulsion Systems, Space Vehicles and Related Equipment).
This final rule revises the Commerce Control List to implement recently agreed changes in the Wassenaar List of Dual-Use Goods and Technologies, as follows:
(1) Increasing the composite theoretical performance (CTP) control parameter for microprocessors in 3A001.a.3.a from 3,500 million theoretical operations per second (MTOPS) to 6,500 MTOPS to account for technological advances and controllability factors (3A001.a.3.a); and
(2) Removing License Exception CIV eligibility for microprocessors, as the CIV limit has been surpassed by the new higher control threshold and BXA has determined that CIV eligibility above the new threshold is not warranted.
(1) Removing the License Exception CIV eligibility for graphic accelerators, as the CIV limit has been surpassed by the new higher control threshold and BXA has determined that CIV eligibility above the new threshold is not warranted.
(2) Revising paragraph (d) in the List of Items Controlled to increase the national security (NS) control level for graphics accelerators and coprocessors from 3 M vectors/sec to 200 M vectors/sec.
(3) Revising paragraph (g) in the List of Items Controlled to increase the NS control level for external interconnects from a data rate of 80 Mbyte/sec to 1.25 Gbyte/sec.
4A994—amended by adding Anti-Terrorism (AT) controls for external interconnects with data rates exceeding 80 Mbyte/s but less than 1.25 Gbyte/sec. These external interconnects have been removed from NS controls as a result of recent changes made by the Wassenaar Arrangement, but continue to remain controlled for AT reasons under this entry.
1. This final rule has been determined to be not significant for purposes of Executive Order 12866.
2. Notwithstanding any other provision of law, no person is required to respond to nor be subject to a penalty for failure to comply with a collection of information subject to the requirements of the Paperwork Reduction Act unless that collection of information displays a current valid OMB Control Number. This regulation involves collections previously approved by Office of Management Budget under control numbers 0694-0088, “Multi-Purpose Application,” which carries a burden hour estimate of 45 minutes per manual submission and 40 minutes per electronic submission. Miscellaneous and recordkeeping activities account for 12 minutes per submission. Information is also collected under OMB control number 0694-0107, “National Defense Authorization Act,” Advance Notifications and Post-Shipment Verification Reports, which carries a burden hour estimate of 15 minutes per report. This rule also involves collections of information under OMB control number 0694-0073, “Export Controls of High Performance Computers” and OMB control number 0694-0093, “Import Certificates and End-User Certificates”.
3. This rule does not contain policies with Federalism implications as that term is defined in Executive Order 13132.
4. The provisions of the Administrative Procedure Act requiring notice of proposed rule making, the opportunity for public participation, and a delay in effective date, are inapplicable because this regulation involves a military or foreign affairs function of the United States (see 5 U.S.C. 553(a)(1)). Further, no other law requires that a notice of proposed rule making and an opportunity for public comment be given for this rule. Because a notice of proposed rule making and opportunities for public comment are not required to be given for this rule by 5 U.S.C. 553, or by any other law, the analytical requirements of the Regulatory Flexibility Act, 5 U.S.C. 601 et seq., are inapplicable.
Therefore, this regulation is issued in final form. Although there is no formal comment period, public comments on this regulation are welcome on a continuing basis. Comments should be submitted to Office of Exporter Services, Bureau of Export Administration, Department of Commerce, P.O. Box 273, Washington, D.C. 20044.Start List of Subjects
List of Subjects 15 CFR Part 774End List of Subjects Start Amendment Part
Accordingly, part 774 of the Export Administration Regulations (End Amendment Part Start Amendment Part
1. The authority citation for part 774 is revised to read as follows:End Amendment Part Start Part
PART 774—[AMENDED]End Part Start Amendment Part
2. In Supplement No. 1 to part 774 (the Commerce Control List), Category 3—Electronics is amended by revising the “License Exceptions” and “List of Items Controlled” section of Export Control Classification Number (ECCN) 3A001, to read as follows:End Amendment Part
3A001 Electronic components, as follows (see List of Items Controlled).
LVS: N/A for MT
$3000: 3A001.b.1, b.2, b.3, .d, .e and .f
$5000: 3A001.a, and .b.4 to b.7
GBS: Yes, except 3A001.a.1.a, b.1, b.3 to b.7, .c to .f
CIV: Yes, except 3A001.a.1, a.2, a.3.a , a.5, a.6, a.9, a.10, and a.12, .b, .c, .d, .e, and .f
List of Items Controlled
Related Controls: See also 3A101, 3A201, and 3A991
Related Definitions: For the purposes of integrated circuits in 3A001.a.1, 5 × 103 Gy(Si) = 5 × 105 Rads (Si); 5 × 106 Gy (Si)/s = 5 × 108 Rads (Si)/s.
a. General purpose integrated circuits, as follows:
The control status of wafers (finished or unfinished), in which the function has been determined, is to be evaluated against the parameters of 3A001.a.Start Printed Page 18404
Integrated circuits include the following types:
“Monolithic integrated circuits”;
“Hybrid integrated circuits”;
“Multichip integrated circuits”;
“Film type integrated circuits”, including silicon-on-sapphire integrated circuits;
“Optical integrated circuits”
a.1. Integrated circuits, designed or rated as radiation hardened to withstand any of the following:
a.1.a. A total dose of 5 × 103 Gy (Si), or higher; or
a.1.b. A dose rate upset of 5 × 106 Gy (Si)/s, or higher;
a.2. “Microprocessor microcircuits”, “microcomputer microcircuits”, microcontroller microcircuits, storage integrated circuits manufactured from a compound semiconductor, analog-to-digital converters, digital-to-analog converters, electro-optical or “optical integrated circuits” designed for “signal processing”, field programmable logic devices, neural network integrated circuits, custom integrated circuits for which either the function is unknown or the control status of the equipment in which the integrated circuit will be used is unknown, Fast Fourier Transform (FFT) processors, electrical erasable programmable read-only memories (EEPROMs), flash memories or static random-access memories (SRAMs), having any of the following:
a.2.a. Rated for operation at an ambient temperature above 398 K (125 °C);
a.2.b. Rated for operation at an ambient temperature below 218 K (−55 °C); or
a.2.c. Rated for operation over the entire ambient temperature range from 218 K (−55 °C) to 398 K (125 °C);
3A001.a.2 does not apply to integrated circuits for civil automobiles or railway train applications.
a.3. “Microprocessor microcircuits”, “micro-computer microcircuits” and microcontroller microcircuits, having any of the following characteristics:
3A001.a.3 includes digital signal processors, digital array processors and digital coprocessors.
a.3.a. A “composite theoretical performance” (“CTP”) of 6,500 million theoretical operations per second (MTOPS) or more and an arithmetic logic unit with an access width of 32 bit or more;
a.3.b. Manufactured from a compound semiconductor and operating at a clock frequency exceeding 40 MHz; or
a.3.c. More than one data or instruction bus or serial communication port for external interconnection in a parallel processor with a transfer rate exceeding 2.5 Mbyte/s;
a.4. Storage integrated circuits manufactured from a compound semiconductor;
a.5. Analog-to-digital and digital-to-analog converter integrated circuits, as follows:
a.5.a. Analog-to-digital converters having any of the following:
a.5.a.1. A resolution of 8 bit or more, but less than 12 bit, with a total conversion time of less than 10 ns;
a.5.a.2. A resolution of 12 bit with a total conversion time of less than 200 ns; or
a.5.a.3. A resolution of more than 12 bit with a total conversion time of less than 2 μs;
a.5.b. Digital-to-analog converters with a resolution of 12 bit or more, and a “settling time” of less than 10 ns;
1. A resolution of n bit corresponds to a quantization of 2n levels.
2. Total conversion time is the inverse of the sample rate.
a.6. Electro-optical and “optical integrated circuits” designed for “signal processing” having all of the following:
a.6.a. One or more than one internal “laser” diode;
a.6.b. One or more than one internal light detecting element; and
a.6.c. Optical waveguides;
a.7. Field programmable logic devices having any of the following:
a.7.a. An equivalent usable gate count of more than 30,000 (2 input gates);
a.7.b. A typical “basic gate propagation delay time” of less than 0.4 ns; or
a.7.c. A toggle frequency exceeding 133 Mhz;
3A001.a.7 includes: Simple Programmable Logic Devices (SPLDs), Complex Programmable Logic Devices (CPLDs), Field Programmable Gate Arrays (FPGAs), Field Programmable Logic Arrays (FPLAs), and Field Programmable Interconnects (FPICs).
N.B.: Field programmable logic devices are also known as field programmable gate or field programmable logic arrays.
a.9. Neural network integrated circuits;
a.10. Custom integrated circuits for which the function is unknown, or the control status of the equipment in which the integrated circuits will be used is unknown to the manufacturer, having any of the following:
a.10.a. More than 208 terminals;
a.10.b. A typical “basic gate propagation delay time” of less than 0.35 ns; or
a.10.c. An operating frequency exceeding 3 GHz;
a.11. Digital integrated circuits, other than those described in 3A001.a.3 to 3A001.a.10 and 3A001.a.12 based upon any compound semiconductor and having any of the following:
a.11.a. An equivalent gate count of more than 3,000 (2 input gates); or
a.11.b. A toggle frequency exceeding 1.2 GHz;
a.12. Fast Fourier Transform (FFT) processors having any of the following:
a.12.a. A rated execution time for a 1,024 point complex FFT of less than 1 ms;
a.12.b. A rated execution time for an N-point complex FFT of other than 1,024 points of less than N log2 N/10,240 ms, where N is the number of points; or
a.12.c. A butterfly throughput of more than 5.12 MHz;
b. Microwave or millimeter wave components, as follows:
b.1. Electronic vacuum tubes and cathodes, as follows:
3A001.b.1 does not control tubes designed or rated to operate in the ITU allocated bands at frequencies not exceeding 31 GHz.
b.1.a. Traveling wave tubes, pulsed or continuous wave, as follows:
b.1.a.1. Operating at frequencies higher than 31 GHz;
b.1.a.2. Having a cathode heater element with a turn on time to rated RF power of less than 3 seconds;
b.1.a.3. Coupled cavity tubes, or derivatives thereof, with an “instantaneous bandwidth” of more than 7% or a peak power exceeding 2.5 kW;
b.1.a.4. Helix tubes, or derivatives thereof, with any of the following characteristics:
b.1.a.4.a. An “instantaneous bandwidth” of more than one octave, and average power (expressed in kW) times frequency (expressed in GHz) of more than 0.5;
b.1.a.4.b. An “instantaneous bandwidth” of one octave or less, and average power (expressed in kW) times frequency (expressed in GHz) of more than 1; or
b.1.a.4.c. Being “space qualified”;
b.1.b. Crossed-field amplifier tubes with a gain of more than 17 Db;
b.1.c. Impregnated cathodes designed for electronic tubes producing a continuous emission current density at rated operating conditions exceeding 5 A/cm2;
b.2. Microwave integrated circuits or modules having all of the following:
b.2.a. Containing “monolithic integrated circuits”; and
b.2.b. Operating at frequencies above 3 GHz;
3A001.b.2 does not control circuits or modules for equipment designed or rated Start Printed Page 18405to operate in the ITU allocated bands at frequencies not exceeding 31 GHz.
b.3. Microwave transistors rated for operation at frequencies exceeding 31 GHz;
b.4. Microwave solid state amplifiers, having any of the following:
b.4.a. Operating frequencies exceeding 10.5 GHz and an “instantaneous bandwidth” of more than half an octave; or
b.4.b. Operating frequencies exceeding 31 GHz;
b.5. Electronically or magnetically tunable band-pass or band-stop filters having more than 5 tunable resonators capable of tuning across a 1.5:1 frequency band (Fmax/Fmin) in less than 10 μs having any of the following:
b.5.a. A band-pass bandwidth of more than 0.5% of center frequency; or
b.5.b. A band-stop bandwidth of less than 0.5% of center frequency;
b.6. Microwave “assemblies” capable of operating at frequencies exceeding 31 GHz;
b.7. Mixers and converters designed to extend the frequency range of equipment described in 3A002.c, 3A002.e or 3A002.f beyond the limits stated therein;
b.8. Microwave power amplifiers containing tubes controlled by 3A001.b and having all of the following:
b.8.a. Operating frequencies above 3 GHz;
b.8.b. An average output power density exceeding 80 W/kg; and
b.8.c. A volume of less than 400 cm3;
3A001.b.8 does not control equipment designed or rated for operation in an ITU allocated band.
c. Acoustic wave devices, as follows, and specially designed components therefor:
c.1. Surface acoustic wave and surface skimming (shallow bulk) acoustic wave devices (i.e., “signal processing” devices employing elastic waves in materials), having any of the following:
c.1.a. A carrier frequency exceeding 2.5 GHz;
c.1.b. A carrier frequency exceeding 1 GHz, but not exceeding 2.5 GHz, and having any of the following:
c.1.b.1. A frequency side-lobe rejection exceeding 55 Db;
c.1.b.2. A product of the maximum delay time and the bandwidth (time in μs and bandwidth in MHz) of more than 100;
c.1.b.3. A bandwidth greater than 250 MHz; or
c.1.b.4. A dispersive delay of more than 10 μs; or
c.1.c. A carrier frequency of 1 GHz or less, having any of the following:
c.1.c.1. A product of the maximum delay time and the bandwidth (time in μs and bandwidth in MHz) of more than 100;
c.1.c.2. A dispersive delay of more than 10 μs; or
c.1.c.3. A frequency side-lobe rejection exceeding 55 Db and a bandwidth greater than 50 MHz;
c.2. Bulk (volume) acoustic wave devices (i.e., “signal processing” devices employing elastic waves) that permit the direct processing of signals at frequencies exceeding 1 GHz;
c.3. Acoustic-optic “signal processing” devices employing interaction between acoustic waves (bulk wave or surface wave) and light waves that permit the direct processing of signals or images, including spectral analysis, correlation or convolution;
d. Electronic devices and circuits containing components, manufactured from “superconductive” materials specially designed for operation at temperatures below the “critical temperature” of at least one of the “superconductive” constituents, with any of the following:
d.1. Current switching for digital circuits using “superconductive” gates with a product of delay time per gate (in seconds) and power dissipation per gate (in watts) of less than 1014 J; or
d.2. Frequency selection at all frequencies using resonant circuits with Q-values exceeding 10,000;
e. High energy devices, as follows:
e.1. Batteries and photovoltaic arrays, as follows:
3A001.e.1 does not control batteries with volumes equal to or less than 27 cm3 (e.g., standard C-cells or R14 batteries).
e.1.a. Primary cells and batteries having an energy density exceeding 480 Wh/kg and rated for operation in the temperature range from below 243 K (−30 °C) to above 343 K (70 °C);
e.1.b. Rechargeable cells and batteries having an energy density exceeding 150 Wh/kg after 75 charge/discharge cycles at a discharge current equal to C/5 hours (C being the nominal capacity in ampere hours) when operating in the temperature range from below 253 K (−20 °C) to above 333 K (60 °C);
Energy density is obtained by multiplying the average power in watts (average voltage in volts times average current in amperes) by the duration of the discharge in hours to 75% of the open circuit voltage divided by the total mass of the cell (or battery) in kg.
e.1.c. “Space qualified” and radiation hardened photovoltaic arrays with a specific power exceeding 160 W/m2 at an operating temperature of 301 K (28 °C) under a tungsten illumination of 1 kW/m2 at 2,800 K (2,527 °C);
e.2. High energy storage capacitors, as follows:
e.2.a. Capacitors with a repetition rate of less than 10 Hz (single shot capacitors) having all of the following:
e.2.a.1. A voltage rating equal to or more than 5 kV;
e.2.a.2. An energy density equal to or more than 250 J/kg; and
e.2.a.3. A total energy equal to or more than 25 kJ;
e.2.b. Capacitors with a repetition rate of 10 Hz or more (repetition rated capacitors) having all of the following:
e.2.b.1. A voltage rating equal to or more than 5 kV;
e.2.b.2. An energy density equal to or more than 50 J/kg;
e.2.b.3. A total energy equal to or more than 100 J; and
e.2.b.4. A charge/discharge cycle life equal to or more than 10,000;
e.3. “Superconductive” electromagnets and solenoids specially designed to be fully charged or discharged in less than one second, having all of the following:
3A001.e.3 does not control “superconductive” electromagnets or solenoids specially designed for Magnetic Resonance Imaging (MRI) medical equipment.
e.3.a. Energy delivered during the discharge exceeding 10 kJ in the first second;
e.3.b. Inner diameter of the current carrying windings of more than 250 mm; and
e.3.c. Rated for a magnetic induction of more than 8 T or “overall current density” in the winding of more than 300 A/mm2;
f. Rotary input type shaft absolute position encoders having any of the following:
f.1. A resolution of better than 1 part in 265,000 (18 bit resolution) of full scale; or
f.2. An accuracy better than ± 2.5 seconds of arc.
3. In Supplement No. 1 to part 774 (the Commerce Control List), Category 4—Computers is amended by revising “License Exceptions” and “List of Items Controlled” sections of Export Control Classification Number (ECCN) 4A003; and by revising the “List of Items Controlled” section in ECCN 4A994, to read as follows:
4A003 “Digital computers”, “electronic assemblies”, and related equipment therefor, and specially designed components therefor.
LVS: $5000; N/A for MT “digital” computers controlled by 4A003.b and having a CTP exceeding 12,500 MTOPS; Start Printed Page 18406or “electronic assemblies” controlled by 4A003.c and capable of enhancing performance by aggregation of “computing elements” so that the CTP of the aggregation exceeds 12,500 MTOPS.
GBS: Yes, for 4A003.d, .e, and .g and specially designed components therefor, exported separately or as part of a system.
CTP: Yes, for computers controlled by 4A003.a, .b and .c, to the exclusion of other technical parameters, with the exception of parameters specified as controlled for Missile Technology (MT) concerns and 4A003.e (equipment performing analog-to-digital or digital-to-analog conversions exceeding the limits of 3A001.a.5.a). See § 740.7 of the EAR.
CIV: Yes, for .e, and .g.
List of Items Controlled
Unit: Equipment in number; parts and accessories in $ value
Related Controls: See also 4A994 and 4A980
Related Definitions: N/A
4A003 includes the following:
a. Vector processors;
b. Array processors;
c. Digital signal processors;
d. Logic processors;
e. Equipment designed for “image enhancement”;
f. Equipment designed for “signal processing”.
The control status of the “digital computers” and related equipment described in 4A003 is determined by the control status of other equipment or systems provided:
a. The “digital computers” or related equipment are essential for the operation of the other equipment or systems;
b. The “digital computers” or related equipment are not a “principal element” of the other equipment or systems; and
N.B. 1: The control status of “signal processing” or “image enhancement” equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the “principal element” criterion.
N.B. 2: For the control status of “digital computers” or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications).
c. The “technology” for the “digital computers” and related equipment is determined by 4E.
a. Designed or modified for “fault tolerance”;
For the purposes of 4A003.a., “digital computers” and related equipment are not considered to be designed or modified for “fault tolerance” if they utilize any of the following:
1. Error detection or correction algorithms in “main storage”;
2. The interconnection of two “digital computers” so that, if the active central processing unit fails, an idling but mirroring central processing unit can continue the system's functioning;
3. The interconnection of two central processing units by data channels or by use of shared storage to permit one central processing unit to perform other work until the second central processing unit fails, at which time the first central processing unit takes over in order to continue the system's functioning; or
4. The synchronization of two central processing units by “software” so that one central processing unit recognizes when the other central processing unit fails and recovers tasks from the failing unit.
b. “Digital computers” having a “composite theoretical performance” (“CTP”) exceeding 6,500 million theoretical operations per second (MTOPS);
c. “Electronic assemblies” specially designed or modified to be capable of enhancing performance by aggregation of “computing elements” (“CEs”) so that the “CTP” of the aggregation exceeds the limit in 4A003.b.;
4A003.c applies only to “electronic assemblies” and programmable interconnections not exceeding the limit in 4A003.b. when shipped as unintegrated “electronic assemblies”. It does not apply to “electronic assemblies” inherently limited by nature of their design for use as related equipment controlled by 4A003.d, or 4A003.e
4A003.c does not control “electronic assemblies” specially designed for a product or family of products whose maximum configuration does not exceed the limit of 4A003.b.
d. Graphics accelerators and graphics coprocessors exceeding a “three dimensional Vector Rate” of 200,000,000;
e. Equipment performing analog-to-digital conversions exceeding the limits in 3A001.a.5;
g. Equipment specially designed to provide external interconnection of “digital computers” or associated equipment that allows communications at data rates exceeding 1.25 Gbyte/s.
4A003.g does not control internal interconnection equipment (e.g., backplanes, buses) passive interconnection equipment, “network access controllers” or “communication channel controllers”.
4A994 Computers, “Electronic Assemblies”, and Related Equipment Not Controlled by 4A001, 4A002, or 4A003, and Specially Designed Components Therefor
List of Items Controlled
Unit: Equipment in number; parts and accessories in $ value
Related Controls: N/A
Related Definitions: N/A
a. Electronic computers and related equipment, and “electronic assemblies” and specially designed components therefor, rated for operation at an ambient temperature above 343 K (70 °C);
b. “Digital computers” having a “composite theoretical performance” (“CTP”) equal to or greater than 6 million theoretical operations per second (MTOPS);
c. “Electronic assemblies” that are specially designed or modified to enhance performance by aggregation of “computing elements” (“CEs”), as follows:
c.1. Designed to be capable of aggregation in configurations of 16 or more “computing elements” (“CEs”); or
c.2. Having a sum of maximum data rates on all channels available for connection to associated processors exceeding 40 million Byte/s;
4A994.c applies only to “electronic assemblies” and programmable interconnections with a “CTP” not exceeding the limits in 4A994.b, when shipped as unintegrated “electronic assemblies”. It does not apply to “electronic assemblies” inherently limited by nature of their design for use as related equipment controlled by 4A994.
4A994.c does not control any “electronic assembly” specially designed for a product or family of products whose maximum configuration does not exceed the limits of 4A994.b.
d. Disk drives and solid state storage equipment:
d.1. Magnetic, erasable optical or magneto-optical disk drives with a “maximum bit transfer rate” exceeding 25 million bit/s;
d.2. Solid state storage equipment, other than “main storage” (also known as solid state disks or RAM disks), with a “maximum bit transfer rate” exceeding 36 million bit/s;
e. Input/output control units designed for use with equipment controlled by 4A994.d;
f. Equipment for “signal processing” or “image enhancement” having a “composite theoretical performance” (“CTP”) exceeding 8.5 million theoretical operations per second (MTOPS);
g. Graphics accelerators or graphics coprocessors that exceed a “three dimensional vector rate” of 400,000 or, if supported by 2-D vectors only, a “two dimensional vector rate” of 600,000;Start Printed Page 18407
The provisions of 4A994.g do not apply to work stations designed for and limited to:
a. Graphic arts (e.g., printing, publishing); and
b. The display of two-dimensional vectors.
h. Color displays or monitors having more than 120 resolvable elements per cm in the direction of the maximum pixel density;
4A994.h does not control displays or monitors not specially designed for electronic computers.
Displays specially designed for air traffic control (ATC) systems are treated as specially designed components for ATC systems under Category 6.
i. Equipment containing “terminal interface equipment” exceeding the limits in 5A991.
For the purposes of 4A994.i, “terminal interface equipment” includes “local area network” interfaces, modems and other communications interfaces. “Local area network” interfaces are evaluated as “network access controllers”.
j. Equipment specially designed to provide external interconnection of “digital computers” or associated equipment that allows communications at data rates exceeding 80 Mbyte/s.
4A994.j does not control internal interconnection equipment (e.g., backplanes, buses) passive interconnection equipment, “network access controllers” or “communication channel controllers”.
Dated: April 3, 2001.
Matthew S. Borman,
Deputy Assistant Secretary for Export Administration.
[FR Doc. 01-8636 Filed 4-6-01; 8:45 am]
BILLING CODE 3510-33-P