This notice is to inform the public that the Export-Import Bank of the United States has received an application to finance the export of approximately $1.2 billion in U.S. semiconductor manufacturing equipment to dedicated foundries in China. The U.S. exports will enable the dedicated 200-mm and 300-mm foundries to produce approximately 80,000 wafers per month (200-mm equivalent) of logic products. Available information indicates that some of this new production will be exported from China and consumed globally. Interested parties may submit comments on this transaction by e-mail to firstname.lastname@example.org or by mail to 811 Vermont Avenue, NW., Room 1238, Washington, DC 20571, within 14 days of the date this notice appears in the Federal Register.Start Signature
Helene S. Walsh,
Director, Policy Oversight and Review.
[FR Doc. 04-28101 Filed 12-22-04; 8:45 am]
BILLING CODE 6690-01-P